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US Patent 10192827 Transmit-and-receive module

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Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
101928270
Patent Inventor Names
Yuji Takematsu0
Hideki Matsui0
Date of Patent
January 29, 2019
0
Patent Application Number
158404830
Date Filed
December 13, 2017
0
Patent Citations Received
‌
US Patent 11546003 Radio frequency module and communication device
Patent Primary Examiner
‌
Tuan T Dinh
0
Patent abstract

A transmit-and-receive module includes a wiring substrate, a low-noise amplifier, a power amplifier, an insulating resin, and a conductive shield. The wiring substrate has a first surface and a second surface which is a back side of the first surface. The low-noise amplifier includes a first signal terminal and a first ground terminal. The first signal terminal is surface-mounted on the first surface. The power amplifier includes a second signal terminal and a second ground terminal. The second signal terminal and the second ground terminal are surface-mounted on the first surface. The insulating resin covers the low-noise amplifier and the power amplifier. The conductive shield covers a surface of the insulating resin. The first ground terminal is connected to the conductive shield.

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