US Patent 10181431 Package substrate and method of manufacturing the same
Patent 10181431 was granted and assigned to Samsung on January, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 1, 2016
Date of Patent
January 15, 2019
Patent Applicant
Patent Application Number
15088666
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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