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US Patent 10155313 Discrete assemblers utilizing conventional motion systems

Patent 10155313 was granted and assigned to Massachusetts Institute of Technology on December, 2018 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
Massachusetts Institute of Technology
Massachusetts Institute of Technology
Current Assignee
Massachusetts Institute of Technology
Massachusetts Institute of Technology
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10155313
Date of Patent
December 18, 2018
Patent Application Number
15031545
Date Filed
April 22, 2016
Patent Citations Received
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US Patent D980882 3D printer hotend
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US Patent D905768 3D printer hotend
0
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US Patent 11424144 Conformal manufacturing device and method for complex curved-surface electronic system
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US Patent D853456 Machining sample model of machine tools
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US Patent D875794 3D printer hotend
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US Patent D888114 3D printer hotend
Patent Primary Examiner
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Darrin D Dunn
Patent abstract

An alternative to additive manufacturing is disclosed, introducing an end-to-end workflow in which discrete building blocks are reversibly joined to produce assemblies called digital materials. Described is the design of the bulk-material building blocks and the devices that are assembled from them. Detailed is the design and implementation of an automated assembler, which takes advantage of the digital material structure to avoid positioning errors within a large tolerance. To generate assembly sequences, a novel CAD/CAM workflow is described for designing, simulating, and assembling digital materials. The structures assembled using this process have been evaluated, showing that the joints perform well under varying conditions and that the assembled structures are functionally precise.

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