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US Patent 10147747 Semiconductor device, manufacturing method thereof, and electronic device

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Contents

Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
101477471
Patent Inventor Names
Mai Sugikawa1
Satoshi Toriumi1
Yoshikazu Hiura1
Date of Patent
December 4, 2018
1
Patent Application Number
148242681
Date Filed
August 12, 2015
1
Patent Citations Received
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US Patent 12120914 Display device and manufacturing method thereof
2
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US Patent 11749691 Electronic device substrate, manufacturing method thereof, and electronic device
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US Patent 11783777 Pixel circuit and driving method thereof, display substrate and driving method thereof, and display apparatus
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US Patent 11404451 Electronic device substrate, manufacturing method thereof, and electronic device
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US Patent 11404447 Display device and electronic device
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US Patent 11930664 Display device with transistors oriented in directions intersecting direction of driving transistor and manufacturing method thereof
6
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US Patent 12029065 Display device and manufacturing method thereof and driving substrate
7
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US Patent 11532802 Display panel and manufacturing method thereof, display device
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Patent Primary Examiner
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Patent abstract

A semiconductor device includes a first layer, a second layer over the first layer, and a third layer over the second layer. The first layer includes a first transistor. The third layer includes a second transistor. A channel formation region of the first transistor includes a single crystal semiconductor. A channel formation region of the second transistor includes an oxide semiconductor. The second layer includes a first insulating film, a second insulating film, and a conductive film. The conductive film has a function of electrically connecting the first transistor and the second transistor. The first insulating film is over and in contact with the conductive film. The second insulating film is provided over the first insulating film. The second insulating film includes a region with a carbon concentration of greater than or equal to 1.77×1017 atoms/cm3 and less than or equal to 1.0×1018 atoms/cm3.

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