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US Patent 10145014 Film forming apparatus

Patent 10145014 was granted and assigned to Tokyo Electron on December, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Tokyo Electron
Tokyo Electron
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Date Filed
April 17, 2013
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Date of Patent
December 4, 2018
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Patent Applicant
Tokyo Electron
Tokyo Electron
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Patent Application Number
14416418
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Patent Citations Received
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US Patent 12080571 Substrate processing module and method of moving a workpiece
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US Patent 11600507 Pedestal assembly for a substrate processing chamber
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US Patent 11610799 Electrostatic chuck having a heating and chucking capabilities
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US Patent 11674227 Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
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US Patent 11749542 Apparatus, system, and method for non-contact temperature monitoring of substrate supports
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US Patent 12002668 Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool
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US Patent 10519550 Film formation apparatus
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US Patent 10550467 Film formation apparatus
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US Patent 10844489 Film forming apparatus and shower head
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US Patent 10998209 Substrate processing platforms including multiple processing chambers
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Patent Inventor Names
Masahide Iwasaki
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Toshihiko Iwao
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Toshihisa Nozawa
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10145014
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Patent Primary Examiner
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Rakesh K Dhingra
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