US Patent 10133180 Microelectronic substrate cleaning compositions having copper/azole polymer inhibition

Semi-aqueous, alkaline microelectronic cleaning composition of pH ≥8 containing:(A) at least one secondary alkanolamine that generates hydroxides when in contact with water;(B) at least one organic alcohol ether solvent having an evaporation rate of 0.3 or less when n-butyl acetate's evaporation rate is taken as the baseline rate of 1.0;(C) at least one corrosion inhibiting cyclic amide compound;(D) at least one pH balancing azole metal corrosion inhibitor in an amount of 0.08% or less by weight of the composition; and(E) water;and optionally(F) at least one polyhydroxylated phenol compound corrosion inhibitor; and(G) at least one polyalcohol or polythiol surface modification agent containing vicinal hydroxyl or vicinal sulfhydryl groups to pair with the polyhydroxylated phenol compound corrosion inhibitor.