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US Patent 10128325 Inductor structures for integrated circuits

Patent 10128325 was granted and assigned to Wafertech on November, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
Wafertech
Wafertech
0
Date Filed
March 23, 2015
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Date of Patent
November 13, 2018
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Patent Applicant
Wafertech
Wafertech
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Patent Application Number
14666107
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Patent Citations Received
‌
US Patent 11670670 Manufacturing method of package
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Patent Inventor Names
Wen-Bin Tsai
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Hsin-I Li
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Kin Fung (Wayne) Lam
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10128325
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Patent Primary Examiner
‌
Elvin G. Enad
0

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