US Patent 10104761 Cooling techniques to improve thermal performance of electroacoustic device

A loudspeaker assembly comprises an enclosure having a first end and a second end, the first end including an opening; an acoustic driver at the second end of the enclosure; an acoustic volume between the first end and the second of the enclosure; a circuit board at the first end of the enclosure; a firebox covering the opening at the first end of the enclosure, the firebox providing a convection flow path in the acoustic volume over heat-generating components of the circuit board; and a heat sink extending from the circuit board in a direction away from the acoustic volume for providing a conduction flow path through the circuit board.