US Patent 10101670 Statistical model-based metrology

Patent 10101670 was granted and assigned to KLA-Tencor on October, 2018 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Current Assignee

KLA-Tencor

Date Filed

March 24, 2014

Date of Patent

October 16, 2018

Patent Applicant

KLA-Tencor

Patent Application Number

14223045

Patent Citations Received

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US Patent 12085515 Methods and systems for selecting wafer locations to characterize cross-wafer variations based on high-throughput measurement signals

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US Patent 11402429 High precision optical characterization of carrier transport properties in semiconductors

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US Patent 11880142 Self-calibrating overlay metrology

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US Patent 11955391 Process monitoring of deep structures with X-ray scatterometry

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US Patent 12019030 Methods and systems for targeted monitoring of semiconductor measurement quality

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US Patent 12025575 Soft x-ray optics with improved filtering

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US Patent 11520321 Measurement recipe optimization based on probabilistic domain knowledge and physical realization

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US Patent 11530913 Methods and systems for determining quality of semiconductor measurements

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US Patent 10732516 Process robust overlay metrology based on optical scatterometry

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US Patent 11062928 Process optimization using design of experiments and response surface models

•••

Patent Inventor Names

Jonathan M. Madsen

Stilian Ivanov Pandev

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10101670

Patent Primary Examiner

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Hugh Jones

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