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US Patent 10083834 Methods of forming self-aligned vias

Patent 10083834 was granted and assigned to Applied Materials on September, 2018 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Applied Materials
Applied Materials
1
Current Assignee
Applied Materials
Applied Materials
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
100838341
Patent Inventor Names
David Thompson1
Ziqing Duan1
Abhijit Basu Mallick1
Benjamin Schmiege1
Jeffrey W. Anthis1
Susmit Singha Roy1
Date of Patent
September 25, 2018
1
Patent Application Number
157181481
Date Filed
September 28, 2017
1
Patent Citations Received
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US Patent 11062942 Methods for controllable metal and barrier-liner recess
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US Patent 11469113 High pressure and high temperature anneal chamber
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US Patent 11694912 High pressure and high temperature anneal chamber
5
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US Patent 11705366 Methods for controllable metal and barrier-liner recess
6
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US Patent 11705337 Tungsten defluorination by high pressure treatment
7
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US Patent 11749555 Semiconductor processing system
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US Patent 11756803 Gas delivery system for high pressure processing chamber
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US Patent 11315943 Bottom-up approach to high aspect ratio hole formation in 3D memory structures
...
Patent Primary Examiner
‌
Richard Booth
1
Patent abstract

Processing methods comprising selectively orthogonally growing a first material through a mask to provide an expanded first material are described. The mask can be removed leaving the expanded first material extending orthogonally from the surface of the first material. Further processing can create a self-aligned via.

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