US Patent 10076356 Subcutaneous needle insertion mechanism

A subcutaneous access device has a skin attachment plate coated with an adhesive layer. The skin attachment plate is moveably linked by a retraction mechanism to a needle support with fixedly positioned needles. In the ready-to-use position the skin attachment plate is spaced away from the needle support and covers the fixedly positioned needles. Subcutaneous insertion of the needles is effected by attachment of the skin attachment plate with the adhesive layer to the skin and releasing the retraction mechanism, thus triggering the pulling of the attached skin with high velocity against the tip of the needles.