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US Patent 10074630 Semiconductor package with high routing density patch

Patent 10074630 was granted and assigned to Amkor Technology on September, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Amkor Technology
Amkor Technology
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Date Filed
April 14, 2015
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Date of Patent
September 11, 2018
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Patent Applicant
Amkor Technology
Amkor Technology
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Patent Application Number
14686725
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Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11289451 Semiconductor package with high routing density patch
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US Patent 11749586 Semiconductor device including through via structure
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 11521934 Semiconductor package including interposer and method of manufacturing the semiconductor package
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US Patent 10672740 Semiconductor package with high routing density patch
Patent Inventor Names
David Jon Hiner
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Michael Kelly
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Ronald Patrick Huemoeller
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10074630
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Patent Primary Examiner
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Khiem D Nguyen
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