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US Patent 10069248 Connector housing with heat dissipation structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 22, 2016
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Date of Patent
September 4, 2018
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Patent Application Number
15136008
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Patent Citations Received
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US Patent 11988468 Heat sink and housing assembly
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US Patent 11262140 Heat sink and housing assembly
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US Patent 11650384 Thermal optimizations for OSFP optical transceiver modules
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US Patent 11303059 Electrical connector with heat sink securing structure
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US Patent 11792958 Connector assembly
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US Patent 11404829 Pluggable electronic receptacle connector with heat-sink assembly
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US Patent 11249264 Thermal optimizations for OSFP optical transceiver modules
Patent Inventor Names
Ding Yong Zeng
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Hou-An Su
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10069248
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Patent Primary Examiner
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Felix O Figueroa
0

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