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US Patent 10056268 Limiting electronic package warpage

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
October 25, 2017
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Date of Patent
August 21, 2018
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Patent Application Number
15792803
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Patent Citations Received
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US Patent 11450513 Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials
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US Patent 10559475 Control of directionality in atomic layer etching
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US Patent 10685836 Etching substrates using ALE and selective deposition
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US Patent 10727073 Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces
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US Patent 10796978 TIM strain mitigation in electronic modules
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US Patent 10304659 Ale smoothness: in and outside semiconductor industry
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Patent Inventor Names
Shidong Li
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10056268
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Patent Primary Examiner
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Matthew Reames
0

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