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US Patent 10056157 Memory apparatus with post package repair

Patent 10056157 was granted and assigned to Micron Technology on August, 2018 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Patent Applicant
Micron Technology
Micron Technology
Current Assignee
Micron Technology
Micron Technology
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10056157
Date of Patent
August 21, 2018
Patent Application Number
15714752
Date Filed
September 25, 2017
Patent Citations Received
‌
US Patent 10347328 SRAM with multiple power domains
‌
US Patent 10217525 Memory apparatus with post package repair
Patent Primary Examiner
‌
Son Dinh
Patent abstract

Apparatuses for memory repair for a memory device are described. An example apparatus includes: a non-volatile storage element that stores information; a storage latch circuit coupled to the non-volatile storage element and stores latch information; and a control circuit that, in a first repair mode, receives first repair address information, provides the first repair address information to the non-volatile storage element, and further transmits the first repair address information from the non-volatile storage element to the storage latch circuit. The control circuit, in a second repair mode, receives second repair address information and provides the second repair address information to the storage latch circuit and disables storing the second address information into the non-volatile storage element.

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