Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael Snyder0
Aaron Kemmer0
Jason Dunn0
Michael Chen0
Date of Patent
August 21, 2018
0Patent Application Number
144852400
Date Filed
September 12, 2014
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
An extended structure additive manufacturing device and method are provided. The device includes a movable material bonding component and a movement mechanism which enable the device to create parts outside the conventional additive manufacturing device print volumes defined by the device and its print-head. Methods of making parts involve creating a portion of a part and moving the extended structure additive manufacturing device relative to the part and printing a second portion of the part. Parts incapable of being formed using a conventional additive manufacturing device may be made using the extended structure additive manufacturing device and/or methods disclosed herein.
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