US Patent 10049743 Semiconductor device and method of manufacturing the same
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Patent abstract
A semiconductor device may be provided. The semiconductor device may include a sub-channel layer located over a conductive layer. The semiconductor device may include a hole source layer interposed between the conductive layer and the sub-channel layer. The semiconductor device may include source select lines located over the sub-channel layer. The semiconductor device may include source channel layers contacting the sub-channel layer by penetrating the source select lines.
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Patent Inventor Names
Nam Jae Lee0
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Patent Jurisdiction
Patent Number
100497430
Date of Patent
August 14, 2018
0Patent Application Number
153417710
Date Filed
November 2, 2016
0Patent Citations Received
Patent Primary Examiner
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US Patent 10049743 Semiconductor device and method of manufacturing the same
Infobox
Is a
Patent jurisdiction
Patent number
10049743
Date of patent
August 14, 2018
Patent application number
15341771
Date Filed
November 2, 2016
Patent primary examiner
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