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US Patent 10043730 Stacked silicon package assembly having an enhanced lid

Patent 10043730 was granted and assigned to Xilinx on August, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Xilinx
Xilinx
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Date Filed
September 28, 2015
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Date of Patent
August 7, 2018
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Patent Applicant
Xilinx
Xilinx
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Patent Application Number
14867349
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Patent Citations Received
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US Patent 12119275 Recessed lid and ring designs and lid local peripheral reinforcement designs
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US Patent 11246211 Micro device with through PCB cooling
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US Patent 11605886 Radome with integrated passive cooling
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US Patent 11330738 Force balanced package mounting
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US Patent 11373929 Thermal heat spreader plate for electronic device
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US Patent 11488887 Thermal enablement of dies with impurity gettering
Patent Inventor Names
Tien-Yu Lee
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Ferdinand F. Fernandez
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Gamal Refai-Ahmed
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Inderjit Singh
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Ivor G. Barber
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Nael Zohni
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Suresh Ramalingam
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10043730
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Patent Primary Examiner
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Raj R Gupta
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