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US Patent 10032709 Embedding thin chips in polymer

Patent 10032709 was granted and assigned to MC10 on July, 2018 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
MC10
MC10
0
Current Assignee
MC10
MC10
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
100327090
Patent Inventor Names
Mitul Dalal0
Conor Rafferty0
Date of Patent
July 24, 2018
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Patent Application Number
154129930
Date Filed
January 23, 2017
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Patent Primary Examiner
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Yosef Gebreyesus
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Patent abstract

Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.

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