‌

US Patent 10026769 Semiconductor device and solid-state imaging device

Patent 10026769 was granted and assigned to Sony on July, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
1
Current Assignee
Sony
Sony
1
Date Filed
September 19, 2014
1
Date of Patent
July 17, 2018
1
Patent Applicant
Sony
Sony
1
Patent Application Number
15023783
1
Patent Citations Received
‌
US Patent 11462503 Hybrid bonding using dummy bonding contacts
‌
US Patent 10748851 Hybrid bonding using dummy bonding contacts and dummy interconnects
‌
US Patent 10833042 Hybrid bonding using dummy bonding contacts
‌
US Patent 11049834 Hybrid bonding using dummy bonding contacts
‌
US Patent 11626376 Semiconductor device having a plurality of first structural bodies provided below a connection terminal and manufacturing method thereof
7
‌
US Patent 11749702 Image sensor
Patent Inventor Names
Tokihisa Kaneguchi
1
Yoshihisa Kagawa
1
Yoshiya Hagimoto
1
Ikue Mitsuhashi
1
Kenichi Aoyagi
1
Masanaga Fukasawa
1
Nobutoshi Fujii
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
10026769
1
Patent Primary Examiner
‌
Erik Kielin
1
Industry
Request Data

Find more entities like US Patent 10026769 Semiconductor device and solid-state imaging device

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.