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US Patent 10026681 Fan-out semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 27, 2017
Date of Patent
July 17, 2018
Patent Application Number
15469709
Patent Citations Received
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US Patent 12074104 Integrated circuit packages with ring-shaped substrates
0
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US Patent 11309334 Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
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US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
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US Patent 11394386 Logic drive using standard commodity programmable logic IC chips
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US Patent 11227838 Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits
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US Patent 11527474 Integrated circuit package and method
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US Patent 10600748 Fan-out semiconductor package
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US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips
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US Patent 10714437 Fan-out semiconductor package
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US Patent 10819345 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10026681
Patent Primary Examiner
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Luan C Thai

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