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US Patent 10019627 Method and apparatus for authentication of a 3D structure

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10019627
Date of Patent
July 10, 2018
Patent Application Number
15346234
Date Filed
November 8, 2016
Patent Citations Received
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US Patent 12131916 Semiconductor packages with patterns of die-specific information
3
‌
US Patent 11886947 Method for uniquely marking objects
4
‌
US Patent 12022042 Correlated three-layer microtext
5
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US Patent 12067796 Method for detecting fraud in documents
6
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US Patent 10510203 Identification device, identification method, identification program and computer readable medium including the identificatioin program
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US Patent 11532490 Semiconductor packages with indications of die-specific information
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US Patent 11031258 Semiconductor packages with patterns of die-specific information
Patent Primary Examiner
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Stephen R Koziol
Patent abstract

New authentication features are proposed that are visible, can be authenticated with a mobile equipment and yet are challenging to counterfeit. In a possible embodiment, the surface of the authentication feature may have three-dimensional characteristics, which can be recognized by a handheld camera, such as a smartphone camera, while it cannot be easily reproduced by a simple scan and print procedure. In a further possible embodiment, at least two different viewpoints of the authentication feature may be acquired using a smartphone camera and the resulting images may be analyzed using the smartphone processor to identify the three-dimensional characteristics of the authentication feature. The manufacturing of the feature may be performed at a low cost by embossing the three dimensional structure on a surface. The authentication feature may be carried by a self-adhesive label or directly embedded on the product packaging.

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