US Patent 10006304 Component with embedded sensor
Patent 10006304 was granted and assigned to United Technologies on June, 2018 by the United States Patent and Trademark Office.
All edits
Edits on 3 Jan, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 8 Dec, 2023
Golden AI
Edits made to:
Article (+219 characters)
Article
Patent abstract
One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.
Edits on 27 Apr, 2023
Golden AI
Infobox
Patent Citations Received
Edits on 25 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
100063040
Date of Patent
June 26, 2018
0Patent Application Number
150369890
Date Filed
November 14, 2014
0Patent Citations Received
Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
100063040
Date of Patent
June 26, 2018
0Patent Application Number
150369890
Date Filed
November 14, 2014
0Patent Citations Received
Patent Primary Examiner
Edits on 21 Sep, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 10 Feb, 2022
Golden AI
Edits on 28 Jan, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
Edits on 20 Jan, 2022
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 10006304 Component with embedded sensor
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
10006304
Date of patent
June 26, 2018
Patent application number
15036989
Date Filed
November 14, 2014
Patent primary examiner
Find more entities like US Patent 10006304 Component with embedded sensor
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.