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Radiation Monitoring Devices, Inc. STTR Phase II Award, March 2018

A STTR Phase II contract was awarded to Radiation Monitoring Devices, Inc. in March, 2018 for $749,600.0 USD from the U.S. Department of Defense and United States Navy.

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AbstractTimelineTable: Further ResourcesReferences
sbir.gov/node/1587859
Is a
SBIR/STTR Awards
SBIR/STTR Awards

SBIR/STTR Award attributes

SBIR/STTR Award Recipient
Radiation Monitoring Devices, Inc.
Radiation Monitoring Devices, Inc.
1
Government Agency
U.S. Department of Defense
U.S. Department of Defense
1
Government Branch
United States Navy
United States Navy
1
Award Type
STTR1
Contract Number (US Government)
N68335-18-C-01541
Award Phase
Phase II1
Award Amount (USD)
749,6001
Date Awarded
March 12, 2018
1
End Date
April 13, 2021
1
Abstract

To provide power for unmanned aircraft systems (UAS), we propose developing solar cells made using perovskite halide solar absorbers, such as those based upon methylammonium lead iodide (CH3NH3PbI3). Our phase I efforts produced flexible solar cells that exhibited power conversion efficiencies (PCE) of 8.1%, a landmark achievement. The proposed research details how to achieve 20% power conversion efficiency using the perovskite solar cells by tuning the process conditions and the composition of the solar absorber. To achieve the highest power conversion efficiencies, in excess of 20%, the cells will be subjected to a battery of tests to determine the stability of the material by performing industry standard tests, such as light soaking, humidity, and electrical bias stressing. The cells will be integrated into modules, and in order to determine the suitability of the technology for UAS, tests will be performed on the fully integrated module that measure the circuit capacitance-resistance (RC), mechanical strain tests, pressure/shock tests, and radiation damage exposure test. Finally, developing robust encapsulation technologies to seal the cells against moisture will involve tests of potential encapsulants. Manufacturing challenges will involve scaling up the technology to industrially relevant sizes and suitably protecting the modules via encapsulation.

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Further Resources

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References

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