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NANOELECTRONIC IMAGING, INC. SBIR Phase II Award, January 2021

A SBIR Phase II contract was awarded to NanoElectronic Imaging Inc in January, 2021 for $1,099,847.0 USD from the U.S. Department of Defense and Defense Microelectronics Activity.

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sbir.gov/node/2164375
Is a
SBIR/STTR Awards
SBIR/STTR Awards

SBIR/STTR Award attributes

SBIR/STTR Award Recipient
NanoElectronic Imaging Inc
NanoElectronic Imaging Inc
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Government Agency
U.S. Department of Defense
U.S. Department of Defense
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Government Branch
‌
Defense Microelectronics Activity
0
Award Type
SBIR0
Contract Number (US Government)
HQ072721C00020
Award Phase
Phase II0
Award Amount (USD)
1,099,8470
Date Awarded
January 4, 2021
0
End Date
January 10, 2023
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Abstract

The transmission electron microscope (TEM) is the standard high resolution tool for imaging microelectronics. Despite its impressive sensitivity to physical structure (the type, number, and arrangement of atoms), TEM is remarkably inept at detecting electronic and thermal signals, even when equipped with expensive spectroscopic attachments. Electronic and thermal structure determines device function and failure, but in a functional device this structure typically does not provide a TEM-detectable signal. Standard TEM, for instance, cannot distinguish a metal from an insulator, or a hot wire from a cold one. NanoElectronic Imaging, Inc. (NEI) is working to commercialize imaging systems based on scanning TEM electron beam-induced current (STEM EBIC) imaging, a technique that maps electronic and thermal properties at high spatial resolution and thus can complement the physical imaging provided by TEM. In Phase I of this SBIR project, NEI successfully demonstrated STEM EBIC temperature mapping with high spatial and temperature resolution. NEI have also demonstrated STEM EBIC mapping of electronic properties such as conductivity, electrical potential, electric field, and work function.  In Phase II, NEI will develop a complete turn-key STEM EBIC system capable of routinely mapping these otherwise invisible signals. This system will incorporate custom substrates, optimized sample-preparation techniques, low-noise STEM EBIC amplification electronics, and specialized software for data acquisition and analysis. The completed system will streamline STEM EBIC characterization, making it accessible to the non-expert. STEM EBIC images of real-world microelectronic components provide meaningful, actionable information, and can be acquired with little modification of existing characterization workflows.

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