SBIR/STTR Award attributes
Silicon carbide and gallium nitride power devices promise the ability to operate at high temperatures, however, power packaging has hit a plateau in thermal performance due to current die attach materials. Kuprion has developed a novel nanocopper-based die attach material that can be processed at traditional solder temperatures (200 C) yet enable operation at temperatures exceeding 300 C. Phase I efforts proved a 100% survival rate of SiC die on AlN substrates in both thermal cycling (-30 to +250 C) and thermal shock (-20 C to +195 C). Phase II will define the stability of fused nanocopper interfaces over a broader temperature range (-30 to +300 C) and develop methods to ensure long lifetime in relevant conditions. A functional power module will also be built as a demonstrator for future commercial and military partners.
