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Interdisciplinary Consulting Corporation SBIR Phase I Award, October 2020

A SBIR Phase I contract was awarded to Interdisciplinary Consulting Corporation in October, 2020 for $111,471.0 USD from the U.S. Department of Defense and United States Army.

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Contents

sbir.gov/node/2160635
Is a
SBIR/STTR Awards
SBIR/STTR Awards

SBIR/STTR Award attributes

SBIR/STTR Award Recipient
Interdisciplinary Consulting Corporation
Interdisciplinary Consulting Corporation
0
Government Agency
U.S. Department of Defense
U.S. Department of Defense
0
Government Branch
United States Army
United States Army
0
Award Type
SBIR0
Contract Number (US Government)
W911NF-21-P-00410
Award Phase
Phase I0
Award Amount (USD)
111,4710
Date Awarded
October 16, 2020
0
End Date
June 29, 2021
0
Abstract

The Interdisciplinary Consulting Corporation (IC2), in partnership with the Applied Research Laboratories, the University of Texas at Austin (ARL-UT), proposes the development of a wall shear stress measurement system for use in the development of future vertical lift (VL) vehicle platforms.  The goal of this effort is to develop a low-profile, acceleration-compensated wall shear stress sensor package capable of providing mean and fluctuating shear stress data on a rotating frame.  The resulting system will enable direct, quantifiable wall shear stress measurements which are crucial to understanding and characterizing unsteady separating flows. The proposed system will leverage IC2’s existing commercial DirectShear™ wall shear stress sensor system and extend its capabilities to include measurement on thin, rotating bodies.  The sensor system will enable localized, acceleration-compensated, non-intrusive, direct measurement of mean and fluctuating wall shear stress in three-dimensional unsteady flows such as those encountered in rotorcraft.  The differential capacitive measurement scheme offers high sensitivity to in-plane shear stress as well as common-mode rejection of pressure fluctuations. An integrated accelerometer will compensate for acceleration effects to optimize sensor accuracy.  Backside electrical contacts using IC2's patented fabrication and packaging process (U.S. Patent No. 10,461,239) enable a low-profile form factor and smooth sensor surface while significantly reducing fabrication complexity and cost.  Analog and digital electronics will be collocated with the sensor, and the use of slip rings and/or wireless transmission methods will be used to provide power and transmit the sensor signal to a data acquisition system.

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