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H01L 2924/15322

Connection portion the connection portion being formed on the die mounting surface of the substrate being a pin array, e.g. PGA

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Edits on 16 Mar, 2022
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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H01L 2924/1532
Edits on 5 Mar, 2022
"update inverses"
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Golden AI
edited on 5 Mar, 2022
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H01L 2924/1532
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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 H01L 2924/15322

Connection portion the connection portion being formed on the die mounting surface of the substrate being a pin array, e.g. PGA

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Cooperative Patent Classification
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H01L 2924/1532
Website
http://data.epo.org/linked-data/def/cpc/H01L2924-15322

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