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H01L 25/16

Assemblies consisting of a plurality of individual semiconductor or other solid state devices {; Multistep manufacturing processes thereof} the devices being of types provided for in two or more different main groups of [CPC: H01L27/00] - [CPC: H01L49/00] {and [CPC: H01L51/00]}, e.g. forming hybrid circuits

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"update inverses"

edited on 16 Mar, 2022

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Edits on 5 Mar, 2022

"update inverses"

edited on 5 Mar, 2022

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H01L 25/16

Assemblies consisting of a plurality of individual semiconductor or other solid state devices {; Multistep manufacturing processes thereof} the devices being of types provided for in two or more different main groups of [CPC: H01L27/00] - [CPC: H01L49/00] {and [CPC: H01L51/00]}, e.g. forming hybrid circuits

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Patent classification

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Cooperative Patent Classification

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Website

http://data.epo.org/linked-data/def/cpc/H01L25-16

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