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H01L 2224/49113

Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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Edits on 16 Mar, 2022
"Entity importer update"
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Golden AI
edited on 16 Mar, 2022
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H01L 2224/4911
Edits on 5 Mar, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Mar, 2022
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 H01L 2224/49113

Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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Cooperative Patent Classification
Website
http://data.epo.org/linked-data/def/cpc/H01L2224-49113

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