H01L 2224/32148
Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the layer connector connecting to a bonding area protruding from the surface
All edits
Edits on 5 Mar, 2022
Golden AI
Edits made to:
Infobox (+4 properties)
Description (+217 characters)
H01L 2224/32148
Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the layer connector connecting to a bonding area protruding from the surface
Infobox
Classification Type
Parent classification
Find more entities like H01L 2224/32148
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.