H01L 2224/25112
Disposition the connectors being bonded to at least one common bonding area the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body
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Edits on 5 Mar, 2022
Golden AI
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H01L 2224/25112
Disposition the connectors being bonded to at least one common bonding area the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body
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