H01L 2224/17107

Disposition relative to the bonding areas, e.g. bond pads the bump connectors being bonded to at least one common bonding area the bump connectors connecting two common bonding areas

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Edits on 16 Mar, 2022

"Entity importer update"

Golden AI

edited on 16 Mar, 2022

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H01L 2224/17106

Edits on 5 Mar, 2022

"Created via: Entity Importer"

Golden AI

created this topic on 5 Mar, 2022

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Description (+182 characters)

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H01L 2224/17107

Disposition relative to the bonding areas, e.g. bond pads the bump connectors being bonded to at least one common bonding area the bump connectors connecting two common bonding areas

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Patent classification

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Cooperative Patent Classification

Website

http://data.epo.org/linked-data/def/cpc/H01L2224-17107

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