H01L 2224/08121
Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the connected bonding areas being not aligned with respect to each other
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Edits on 16 Mar, 2022
Golden AI
Edits on 5 Mar, 2022
Golden AI
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Description (+196 characters)
H01L 2224/08121
Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the connected bonding areas being not aligned with respect to each other
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