SBIR/STTR Award attributes
Reverse Engineering of Circuit Card Assembly (CCA) – The Phase I SBIR effort determined that there was a need for Failure Analysis effort to address replacement for a Circuit Card Assembly (CCA). This CCA is not obsolete and there is DLA stock. However, the end user has indicated they have had high failure rates for the past 10 years and are seeking a new source of supply. GCI has implemented failure analysis on this part to determine the issue and therefore, will determine a path forward to reverse engineer this CCA to provide a form, fit and function CCA that will be reliable and meet all specification in the Phase II effort. It will also be tested and work successfully in the customer’s next higher assemblies: SRU and LRU. The corresponding NSN for this CCA is 5998-01-549-7929. The ESA (Engineering Support GCI has been involved with DoD stakeholders on other USAF, Army, and NAVSEA programs, identifying innovative methods to develop new solutions to support the warfighter. GCI’s proven technologies provide the building blocks to engineer custom electronic solutions based upon the customer needs and requirements. These drop-in replacement solutions for obsolete microcircuits improve DoD system readiness. GCI has successfully designed and manufactured custom microcircuits and/or CCAs for a broad spectrum of DoD applications. For example, GCI recently provided reverse engineered components for three obsolete microcircuits used in F-16 radar systems at Hill AFB, UT. All three functioned identically to the obsolete microcircuits they replaced at both the Shop Replaceable Unit (SRU) and Line Replacement Unit (LRU) levels. All three of these electronic solutions also passed full MIL-STD-883 Test Method 5005 Groups A, B, C, and D qualification testing. Prior to GCI’s re-engineered replacement parts, the USAF had no other solution, short of a full system redesign which was projected to be $30M. GCI’s solutions prevented Mission Impaired Capability Awaiting Parts (MICAP) events. Because each GCI solution presents unique engineering design challenges to meet application specific requirements, R&D efforts are required. Each reverse engineering effort enables GCI to meet legacy requirements with integration of currently available electronic components. GCI’s TRL for a new application begins at a level 3. Upon completion of each GCI reverse engineering effort, the TRL level will be an 8. Once successful flight missions have been accomplished, the TRL level is raised to a 9. In the Phase I SBIR effort, it was determined that there was a need for replacements of 3 obsolete Circuit Card Assemblies (CCAs). These CCAs are NSN – 5998-01-363-6894, NSN – 5998-01-294-5205, and NSN 5998-01-348-7542. The ESA (Engineering Support Authority) for this project is Alex Matesen C CIV USAF AFMC AFLCMC/EBHGA at Hill AFB, UT. GCI will determine a path forward to reverse engineer these three obsolete CCAs to provide form, fit and function drop-in replacements that will be reliable and meet all specifications in a Phase II effort. Each CCA will be thouroughly tested and work successfully in the customer’s next higher assemblies: SRU and LRU.
