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Adhesion and non-linear rheology of adhesives with supramolecular crosslinking points

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Academic paper
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Academic Paper attributes

arXiv ID
1609.049710
arXiv Classification
Physics
Physics
0
Publication URL
arxiv.org/pdf/1609.0...71.pdf0
Publisher
ArXiv
ArXiv
0
DOI
doi.org/10.48550/ar...09.049710
Paid/Free
Free0
Academic Discipline
Physics
Physics
0
Condensed matter physics
Condensed matter physics
0
Materials science
Materials science
0
Soft matter
Soft matter
0
Submission Date
September 16, 2016
0
December 22, 2016
0
Author Names
L Bouteiller0
X Callies0
SIMM0
IPCM0
S Pensec0
C Creton0
C Fonteneau0
G Ducouret0
Paper abstract

Soft supramolecular materials are promising for the design of innovative and highly tunable adhesives. These materials are composed of polymer chains functionalized by strongly interacting moieties, sometimes called stickers. In order to systematically investigate the effect of the presence of associative groups on the debonding properties of a supramolecular adhesive, a series of supramolecular model systems has been characterized by probe-tack tests. These model materials, composed of linear and low dispersity poly(butylacrylate) chains functionalized in the middle by a single tri-urea sticker, are able to self-associate by six hydrogen bonds and range in molecular weight (M n) between 5 and 85 kg/mol. The linear rheology and the nanostructure of the same materials (called PnBA3U) was the object of a previous study 1,2. At room temperature, the association of polymers via hydrogen bonds induces the formation of rod-like aggregates structured into bundles for M n less 40kg/mol and the behavior of a soft elastic material was observed (GgreatergreaterG and G~omega 0). For higher M n , the filaments were randomly oriented and polymers displayed a crossover towards viscous behavior although terminal relaxation was not reached in the experimental frequency window. All these materials show however similar adhesive properties characterized by a cohesive mode of failure and low debonding energies (W adh less40J/m 2 for a debonding speed of 100mum/s). The debonding mechanisms observed during the adhesion tests have been investigated in detail with an Image tools analysis developed by our group 3. The measure of the projected area covered by cavities growing in the adhesive layer during debonding can be used to estimate the true stress in the walls of the cavities and thus, to characterize the in-situ large strain deformation of the thin layer during the adhesion test itself. This analysis revealed in particular that the PnBA3U materials with M n less 40 kg/mol soften very markedly at large deformation like yield stress fluids, explaining the low adhesion energies measured for these viscoelastic gels. 2

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