SBIR/STTR Award attributes
This SBIR Phase I project will develop lightweight, high-strength, temperature-resilient copper-based cabling derived from a facile manufacturing process. In previous work, large volumetric fractions of gold, silver, and copper nanoparticles (NPs) were incorporated into a porous aramid nanofiber (ANF) matrix to realize films that have high electrical conductivity, yet maintain superior mechanical strength, properties that are usually hard to achieve simultaneously. Furthermore, the composite films demonstrate excellent flexibility, which is superior to other related classes of reported flexible conductors includng carbon based nanomaterials (CNTs and graphene) and other metallic nanomaterials. The unique network structure enables high electrical conductivity and robust mechanical behavior of the metal-ANF films. Most pertinently for mass-restrictive applications, we previously demonstrated that planar copper-ANF composites had ~90 % less mass density than solid copper, but with electrical properties (conductivity, ampacity) that were at least 33 % of the bulk value. During Phase I, we will extend the previous demonstrations done with planar conductors to copper-ANF cylindrical and hollow wires that are relevant to planetary power-handling that require mass-efficient, environmentally-robust materials. We will first find the lower limits of achievable mass that still provides acceptable conductivity, ampacity, and strength in both cylindrical and polygonal cross-sectional solids. We will then characterize the conductive and insulating properties of self-insulated solids, in which the ANF can be functionalized with various levels of conductivity. Finally, we will design manufacturing tools to scale-up the production of the solids.
