List of Silex Microsystems patents

Patents where

Current Assignee

Name

Silex Microsystems

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 9224681 CTE matched interposer and method of making	Patent 9224681 was granted and assigned to Silex Microsystems on December, 2015 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	9224681	December 29, 2015
‌ US Patent 7172911 Deflectable microstructure and method of manufacturing the same through bonding of wafers	Patent 7172911 was granted and assigned to Silex Microsystems on February, 2007 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	7172911	February 6, 2007
‌ US Patent 9240373 Semiconductor devices with close-packed via structures having in-plane routing and method of making same	Patent 9240373 was granted and assigned to Silex Microsystems on January, 2016 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9240373	January 19, 2016
‌ US Patent 7560802 Electrical connections in substrates	Patent 7560802 was granted and assigned to Silex Microsystems on July, 2009 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	7560802	July 14, 2009
‌ US Patent 9448401 Via structure and method thereof	Patent 9448401 was granted and assigned to Silex Microsystems on September, 2016 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9448401	September 20, 2016
‌ US Patent 8729713 Via structure and method thereof	Patent 8729713 was granted and assigned to Silex Microsystems on May, 2014 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	8729713	May 20, 2014
‌ US Patent 9620390 Method of making a semiconductor device having a functional capping	Patent 9620390 was granted and assigned to Silex Microsystems on April, 2017 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9620390	April 11, 2017
‌ US Patent 9607915 Through substrate vias and device	Patent 9607915 was granted and assigned to Silex Microsystems on March, 2017 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9607915	March 28, 2017
‌ US Patent 9312217 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections	Patent 9312217 was granted and assigned to Silex Microsystems on April, 2016 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	9312217	April 12, 2016
‌ US Patent 8308960 Methods for making micro needles and applications thereof	Patent 8308960 was granted and assigned to Silex Microsystems on November, 2012 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	8308960	November 13, 2012
‌ US Patent 9484293 Semiconductor devices with close-packed via structures having in-plane routing and method of making same	Patent 9484293 was granted and assigned to Silex Microsystems on November, 2016 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9484293	November 1, 2016
‌ US Patent 9514985 Electroless metal through silicon via	Patent 9514985 was granted and assigned to Silex Microsystems on December, 2016 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9514985	December 6, 2016
‌ US Patent 9355895 Method of providing a via hole and routing structure	Patent 9355895 was granted and assigned to Silex Microsystems on May, 2016 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	9355895	May 31, 2016
‌ US Patent 9936918 Insulation of micro structures	Patent 9936918 was granted and assigned to Silex Microsystems on April, 2018 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	9936918	April 10, 2018
‌ US Patent 9507142 Precise definition of transducer electrodes	Patent 9507142 was granted and assigned to Silex Microsystems on November, 2016 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9507142	November 29, 2016
‌ US Patent 9613863 Method for forming electroless metal through via	Patent 9613863 was granted and assigned to Silex Microsystems on April, 2017 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9613863	April 4, 2017
‌ US Patent 9362139 Method of making a semiconductor device having a functional capping	Patent 9362139 was granted and assigned to Silex Microsystems on June, 2016 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	9362139	June 7, 2016
‌ US Patent 9511999 Thin film capping	Patent 9511999 was granted and assigned to Silex Microsystems on December, 2016 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9511999	December 6, 2016
‌ US Patent 9190356 Semiconductor devices with close-packed via structures having in-plane routing and method of making same	Patent 9190356 was granted and assigned to Silex Microsystems on November, 2015 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9190356	November 17, 2015
‌ US Patent 7207227 Pressure sensor	Patent 7207227 was granted and assigned to Silex Microsystems on April, 2007 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	7207227	April 24, 2007
‌ US Patent 8729685 Bonding process and bonded structures	Patent 8729685 was granted and assigned to Silex Microsystems on May, 2014 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	8729685	May 20, 2014
‌ US Patent 9718674 Thin capping for MEMS devices	Patent 9718674 was granted and assigned to Silex Microsystems on August, 2017 by the United States Patent and Trademark Office.	Silex Microsystems	Silex Microsystems	United States Patent and Trademark Office	9718674	August 1, 2017
‌ US Patent 9249009 Starting substrate for semiconductor engineering having substrate-through connections and a method for making same	Patent 9249009 was granted and assigned to Silex Microsystems on February, 2016 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	9249009	February 2, 2016
‌ US Patent 8866289 Bonding process and bonded structures	Patent 8866289 was granted and assigned to Silex Microsystems on October, 2014 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	8866289	October 21, 2014
‌ US Patent 8324103 Vias and method of making	Patent 8324103 was granted and assigned to Silex Microsystems on December, 2012 by the United States Patent and Trademark Office.		Silex Microsystems	United States Patent and Trademark Office	8324103	December 4, 2012

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