List of Endicott Interconnect Technologies, Inc. patents

Patents where

Current Assignee

Name

‌

Endicott Interconnect Technologies, Inc.

Name	Description	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 7738249 Circuitized substrate with internal cooling structure and electrical assembly utilizing same	Patent 7738249 was granted and assigned to Endicott Interconnect Technologies, Inc. on June, 2010 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7738249	June 15, 2010
‌ US Patent 7142121 Radio frequency device for tracking goods	Patent 7142121 was granted and assigned to Endicott Interconnect Technologies, Inc. on November, 2006 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7142121	November 28, 2006
‌ US Patent 7235745 Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate	Patent 7235745 was granted and assigned to Endicott Interconnect Technologies, Inc. on June, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7235745	June 26, 2007
‌ US Patent 7161810 Stacked chip electronic package having laminate carrier and method of making same	Patent 7161810 was granted and assigned to Endicott Interconnect Technologies, Inc. on January, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7161810	January 9, 2007
‌ US Patent 7612345 Radiation detector crystal and method of formation thereof	Patent 7612345 was granted and assigned to Endicott Interconnect Technologies, Inc. on November, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7612345	November 3, 2009
‌ US Patent 7381587 Method of making circuitized substrate	Patent 7381587 was granted and assigned to Endicott Interconnect Technologies, Inc. on June, 2008 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7381587	June 3, 2008
‌ US Patent 7972178 High density connector for interconnecting fine pitch circuit packaging structures	Patent 7972178 was granted and assigned to Endicott Interconnect Technologies, Inc. on July, 2011 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7972178	July 5, 2011
‌ US Patent 7541265 Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate	Patent 7541265 was granted and assigned to Endicott Interconnect Technologies, Inc. on June, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7541265	June 2, 2009
‌ US Patent 7176383 Printed circuit board with low cross-talk noise	Patent 7176383 was granted and assigned to Endicott Interconnect Technologies, Inc. on February, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7176383	February 13, 2007
‌ US Patent 8446707 Circuitized substrate with low loss capacitive material and method of making same	Patent 8446707 was granted and assigned to Endicott Interconnect Technologies, Inc. on May, 2013 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	8446707	May 21, 2013
‌ US Patent 7211470 Method and apparatus for depositing conductive paste in circuitized substrate openings	Patent 7211470 was granted and assigned to Endicott Interconnect Technologies, Inc. on May, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7211470	May 1, 2007
‌ US Patent 7633068 Count uniformity correction in flux space for pixilated semiconducting radiation detectors	Patent 7633068 was granted and assigned to Endicott Interconnect Technologies, Inc. on December, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7633068	December 15, 2009
‌ US Patent 7510912 Method of making wirebond electronic package with enhanced chip pad design	Patent 7510912 was granted and assigned to Endicott Interconnect Technologies, Inc. on March, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7510912	March 31, 2009
‌ US Patent 7638776 Staggered array imaging system using pixilated radiation detectors	Patent 7638776 was granted and assigned to Endicott Interconnect Technologies, Inc. on December, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7638776	December 29, 2009
‌ US Patent 7211289 Method of making multilayered printed circuit board with filled conductive holes	Patent 7211289 was granted and assigned to Endicott Interconnect Technologies, Inc. on May, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7211289	May 1, 2007
‌ US Patent 7429510 Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate	Patent 7429510 was granted and assigned to Endicott Interconnect Technologies, Inc. on September, 2008 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7429510	September 30, 2008
‌ US Patent 7596863 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein	Patent 7596863 was granted and assigned to Endicott Interconnect Technologies, Inc. on October, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7596863	October 6, 2009
‌ US Patent 7470990 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Patent 7470990 was granted and assigned to Endicott Interconnect Technologies, Inc. on December, 2008 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7470990	December 30, 2008
‌ US Patent 7145221 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Patent 7145221 was granted and assigned to Endicott Interconnect Technologies, Inc. on December, 2006 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7145221	December 5, 2006
‌ US Patent 7332212 Circuitized substrate with conductive polymer and seed material adhesion layer	Patent 7332212 was granted and assigned to Endicott Interconnect Technologies, Inc. on February, 2008 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7332212	February 19, 2008
‌ US Patent 7679005 Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same	Patent 7679005 was granted and assigned to Endicott Interconnect Technologies, Inc. on March, 2010 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7679005	March 16, 2010
‌ US Patent 7157646 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Patent 7157646 was granted and assigned to Endicott Interconnect Technologies, Inc. on January, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7157646	January 2, 2007
‌ US Patent 7823274 Method of making multilayered circuitized substrate assembly	Patent 7823274 was granted and assigned to Endicott Interconnect Technologies, Inc. on November, 2010 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7823274	November 2, 2010
‌ US Patent 7491896 Information handling system utilizing circuitized substrate with split conductive layer	Patent 7491896 was granted and assigned to Endicott Interconnect Technologies, Inc. on February, 2009 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7491896	February 17, 2009
‌ US Patent 7157647 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Patent 7157647 was granted and assigned to Endicott Interconnect Technologies, Inc. on January, 2007 by the United States Patent and Trademark Office.	‌ Endicott Interconnect Technologies, Inc.	United States Patent and Trademark Office	7157647	January 2, 2007

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