List of Disco Corporation patents

Patents where

Current Assignee

Name

Disco Corporation

Name	Description	Patent Applicant	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 11623300 Method of determining whether or not result of processing process of laser processing apparatus is acceptable	Patent 11623300 was granted and assigned to Disco Corporation on April, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11623300	April 11, 2023
‌ US Patent 11565347 Laser processing machine	Patent 11565347 was granted and assigned to Disco Corporation on January, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11565347	January 31, 2023
‌ US Patent 11577339 Optical axis adjusting method for laser processing apparatus	Patent 11577339 was granted and assigned to Disco Corporation on February, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11577339	February 14, 2023
‌ US Patent 11504804 Method of confirming optical axis of laser processing apparatus	Patent 11504804 was granted and assigned to Disco Corporation on November, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11504804	November 22, 2022
‌ US Patent 11534862 Laser processing apparatus	Patent 11534862 was granted and assigned to Disco Corporation on December, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11534862	December 27, 2022
‌ US Patent 7278903 Processing method for wafer and processing apparatus therefor	Patent 7278903 was granted and assigned to Disco Corporation on October, 2007 by the United States Patent and Trademark Office.		Disco Corporation	United States Patent and Trademark Office	7278903	October 9, 2007
‌ US Patent 11491669 Cutting apparatus, cutting blade replacement method, and board replacement method	Patent 11491669 was granted and assigned to Disco Corporation on November, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11491669	November 8, 2022
‌ US Patent 11380587 Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer	Patent 11380587 was granted and assigned to Disco Corporation on July, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11380587	July 5, 2022
‌ US Patent 11618106 Processing method and laser processing apparatus including imaging detector for SiC ingot	Patent 11618106 was granted and assigned to Disco Corporation on April, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11618106	April 4, 2023
‌ US Patent 7341926 Wafer dividing method	Patent 7341926 was granted and assigned to Disco Corporation on March, 2008 by the United States Patent and Trademark Office.		Disco Corporation	United States Patent and Trademark Office	7341926	March 11, 2008
‌ US Patent 11618698 Waste fluid treatment apparatus and processing water regeneration system	Patent 11618698 was granted and assigned to Disco Corporation on April, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11618698	April 4, 2023
‌ US Patent 11621201 Laser beam spot shape correcting method	Patent 11621201 was granted and assigned to Disco Corporation on April, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11621201	April 4, 2023
‌ US Patent 11651978 Protective sheet application apparatus and method	Patent 11651978 was granted and assigned to Disco Corporation on May, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11651978	May 16, 2023
‌ US Patent 7629230 Wafer processing method	Patent 7629230 was granted and assigned to Disco Corporation on December, 2009 by the United States Patent and Trademark Office.		Disco Corporation	United States Patent and Trademark Office	7629230	December 8, 2009
‌ US Patent 11446771 Method for producing wafers using ultrasound	Patent 11446771 was granted and assigned to Disco Corporation on September, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11446771	September 20, 2022
‌ US Patent 11469094 Method of producing wafer		Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11469094	October 11, 2022
‌ US Patent 11610815 Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer	Patent 11610815 was granted and assigned to Disco Corporation on March, 2023 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11610815	March 21, 2023
‌ US Patent 11289348 Workpiece processing method		Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11289348	March 29, 2022
‌ US Patent 11298928 Protective sheet disposing method		Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11298928	April 12, 2022
‌ US Patent 11538724 Processing method of workpiece with laser power adjustment based on thickness measurement and processing apparatus thereof	Patent 11538724 was granted and assigned to Disco Corporation on December, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11538724	December 27, 2022
‌ US Patent 7580136 Height position detector for work held on chuck table	Patent 7580136 was granted and assigned to Disco Corporation on August, 2009 by the United States Patent and Trademark Office.		Disco Corporation	United States Patent and Trademark Office	7580136	August 25, 2009
‌ US Patent 11311976 Cutting apparatus	Patent 11311976 was granted and assigned to Disco Corporation on April, 2022 by the United States Patent and Trademark Office.	Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11311976	April 26, 2022
‌ US Patent 7569840 Alignment method of a laser beam processing machine	Patent 7569840 was granted and assigned to Disco Corporation on August, 2009 by the United States Patent and Trademark Office.		Disco Corporation	United States Patent and Trademark Office	7569840	August 4, 2009
‌ US Patent 11376707 Grinding method		Disco Corporation	Disco Corporation	United States Patent and Trademark Office	11376707	July 5, 2022
‌ US Patent 7348199 Wafer dividing method	Patent 7348199 was granted and assigned to Disco Corporation on March, 2008 by the United States Patent and Trademark Office.		Disco Corporation	United States Patent and Trademark Office	7348199	March 25, 2008

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