Patent 9877410 was granted and assigned to Daikin Industries, Ltd. on January, 2018 by the United States Patent and Trademark Office.
A cooler is placed on a power module to cool the power module with refrigerant through a refrigerant pipe, and includes a heat transfer plate having a groove into which a cooling pipe is fitted, and a presser plate configured to press the cooling pipe against the groove. The cooler includes a hinge mechanism configured to rotatably attach the presser plate to the heat transfer plate such that the presser plate is switched between an open position at which the groove is exposed and a closed position at which the presser plate covers the groove.