US Patent 9663357 Open cavity package using chip-embedding technology
Patent 9663357 was granted and assigned to Texas Instruments on May, 2017 by the United States Patent and Trademark Office.
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A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.
US Patent 09663357 Open cavity package using chip-embedding technology US Patent 9663357 Open cavity package using chip-embedding technology
US Patent 09663357 Open cavity package using chip-embedding technology
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