Log in
Enquire now
‌

US Patent 9663357 Open cavity package using chip-embedding technology

Patent 9663357 was granted and assigned to Texas Instruments on May, 2017 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Texas Instruments
Texas Instruments
0
Current Assignee
Texas Instruments
Texas Instruments
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
96633570
Patent Inventor Names
Anindya Poddar0
Hau Nguyen0
Jie Mao0
Luu Nguyen0
Date of Patent
May 30, 2017
0
Patent Application Number
149633620
Date Filed
December 9, 2015
0
Patent Citations Received
‌
US Patent 11854922 Semicondutor package substrate with die cavity and redistribution layer
0
‌
US Patent 12125799 Embedded die packaging with integrated ceramic substrate
0
‌
US Patent 11869839 Package panel processing with integrated ceramic isolation
0
Patent Primary Examiner
‌
Earl Taylor
0
Patent abstract

A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 9663357 Open cavity package using chip-embedding technology

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.