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US Patent 9585285 Heat dissipation structure for an electronic device

Patent 9585285 was granted and assigned to Microsoft on February, 2017 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Microsoft
Microsoft
1
Current Assignee
Microsoft
Microsoft
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
95852851
Patent Inventor Names
Michael Beerman1
Roy Riccomini1
Andrew Hodge1
Doug Heirich1
Maosheng Ye1
Michael Nikkhoo1
Date of Patent
February 28, 2017
1
Patent Application Number
147058971
Date Filed
May 6, 2015
1
Patent Citations Received
‌
US Patent 11892645 Intelligent VR elastic bandage equipment
2
Patent Primary Examiner
‌
Anthony Haughton
1
Patent abstract

A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

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