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US Patent 8981382 Semiconductor structure including buffer with strain compensation layers

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Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
89813821
Patent Inventor Names
Xiang Gao1
Date of Patent
March 17, 2015
1
Patent Application Number
137870181
Date Filed
March 6, 2013
1
Patent Citations Received
‌
US Patent 12113123 Superconducting materials, devices, and processes
2
‌
US Patent 11869942 Heteroepitaxial wafer and method for producing a heteroepitaxial wafer
3
Patent Primary Examiner
‌
Brook Kebede
1
Patent abstract

A semiconductor structure includes a substrate and a semiconductor buffer structure overlying the substrate. The semiconductor buffer structure includes a semiconductor body of a gallium nitride material, and a stack of strain compensation layers. The stack of strain compensation layers includes a layer of a first semiconductor material with an in-plane lattice constant that is smaller than a lattice constant of the semiconductor body, and a layer of a second semiconductor material with an in-plane lattice constant that is greater than the lattice constant of the semiconductor body.

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