US Patent 8250506 Bondwire design
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Patent abstract
A system and method of designing the physical shape of and determining the electromagnetic characteristics of a bondwire in an electrical circuit, comprising the steps of enabling a user to define the position of the bondwire in the electrical circuit layout, defining the position and loop shape of the bondwire in a 3D representation of the electrical circuit, segmenting the bondwire into discrete segments, determining the electromagnetic characteristics of each of the bondwire segments thereby to determine the overall electromagnetic characteristics of the bondwire.
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Patent Inventor Names
Konstantinos Nikellis0
Sotirios Bantas0
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US Patent 08250506 Bondwire design US Patent 8250506 Bondwire design
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Patent Number
082505060
Patent Number
82505060
Edits on 27 Sep, 2022
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Patent Jurisdiction
Patent Number
082505060
Date of Patent
August 21, 2012
0Patent Application Number
123591310
Date Filed
January 23, 2009
0Patent Primary Examiner
Edits on 15 Dec, 2021
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US Patent 08250506 Bondwire design
Infobox
Is a
Patent jurisdiction
Patent number
08250506
Date of patent
August 21, 2012
Patent application number
12359131
Date Filed
January 23, 2009
Patent primary examiner
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