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US Patent 8110746 Cooling of substrate using interposer channels

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Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
81107461
Patent Inventor Names
Lawrence S. Mok1
Minhua Lu1
Date of Patent
February 7, 2012
1
Patent Application Number
122330611
Date Filed
September 18, 2008
1
Patent Citations Received
‌
US Patent 11876036 Fluid cooling system including embedded channels and cold plates
2
Patent Primary Examiner
‌
Kambiz Zand
1
Patent abstract

A structure. The structure includes an interposer adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.

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