US Patent 7998229 Polishing composition and polishing method
Patent 7998229 was granted and assigned to Fujimi on August, 2011 by the United States Patent and Trademark Office.
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Patent abstract
The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass. The polishing composition is appropriate for final polishing of silicon wafers.
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Patent Inventor Names
Shuhei Yamada0
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US Patent 07998229 Polishing composition and polishing method US Patent 7998229 Polishing composition and polishing method
Infobox
Patent Number
079982290
Patent Number
79982290
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079982290
Date of Patent
August 16, 2011
0Patent Application Number
117016400
Date Filed
February 2, 2007
0Patent Primary Examiner
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US Patent 07998229 Polishing composition and polishing method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07998229
Date of patent
August 16, 2011
Patent application number
11701640
Date Filed
February 2, 2007
Patent primary examiner
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