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US Patent 7994024 Object cutting method

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Edits on 28 Nov, 2023
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edited on 28 Nov, 2023
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Patent abstract

An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of semiconductor chips 25 obtained by cutting a planar object to be processed along a line to cut are separated from each other on the expandable tape 23. This electric action causes particles remaining on cut sections of the semiconductor chips 25 to eject therefrom even when a molten processed region is formed in the cut sections. Therefore, particles remaining on the cut sections of the chips 25 can reliably be removed.

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Patent Inventor Names
Takeshi Sakamoto1
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US Patent 07994024 Object cutting method US Patent 7994024 Object cutting method

Infobox
Patent Number
079940241
Patent Number
79940241
Edits on 24 Mar, 2023
"Entity importer update"
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Golden AI
edited on 24 Mar, 2023
Infobox
Is a
Patent
Patent
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
079940241
Date of Patent
August 9, 2011
1
Patent Application Number
120313821
Date Filed
February 14, 2008
1
Patent Primary Examiner
‌
Jack Chen
1
Edits on 8 Dec, 2021
"Created via: Entity Importer"
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created this topic on 8 Dec, 2021
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 US Patent 07994024 Object cutting method

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07994024
Date of patent
August 9, 2011
Patent application number
12031382
Date Filed
February 14, 2008
Patent primary examiner
‌
Jack Chen

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