US Patent 7956446 Semiconductor device and method
Patent 7956446 was granted and assigned to Infineon Technologies on June, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A chip carrier includes first, second and third layers with the second layer situated between the first and third layers. The first and third layers are formed of a first material and the second layer is formed of a second material. The second layer has a plurality of holes extending therethrough and the first material fills the holes.
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US Patent 07956446 Semiconductor device and method US Patent 7956446 Semiconductor device and method
Infobox
Patent Number
0795644600
Patent Number
795644600
Edits on 24 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079564460
Date of Patent
June 7, 2011
0Patent Application Number
121196650
Date Filed
May 13, 2008
0Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079564460
Date of Patent
June 7, 2011
0Patent Application Number
121196650
Date Filed
May 13, 2008
0Patent Primary Examiner
Edits on 7 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07956446 Semiconductor device and method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07956446
Date of patent
June 7, 2011
Patent application number
12119665
Date Filed
May 13, 2008
Patent primary examiner
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