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US Patent 7927454 Method of patterning a substrate

Patent 7927454 was granted and assigned to Samsung on April, 2011 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
1

Patent attributes

Current Assignee
Samsung
Samsung
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
79274541
Patent Inventor Names
William A. Tolbert1
Matthew S. Stay1
Robin E. Wright1
Thomas A. Isberg1
Haiyan Zhang1
Joseph W. Woody1
Khanh T. Huynh1
Martin B. Wolk1
Date of Patent
April 19, 2011
1
Patent Application Number
117787321
Date Filed
July 17, 2007
1
Patent Primary Examiner
‌
Philip C. Tucker
1
Patent abstract

A method of forming a metallic material on a receptor that includes the steps of: placing a donor element proximate a receptor, wherein the donor element includes a donor substrate and a thermal transfer layer, wherein the thermal transfer layer includes a catalytic material, and wherein the thermal transfer layer of the donor element is placed proximate the surface of the receptor; thermally transferring at least a portion of the thermal transfer layer from the donor element to the receptor; and electrolessly depositing a metallic material on the receptor by growth of the metallic material on the catalytic material.

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